Plasma Etching Quartz Ring PQ811E Ground Cover Ring for HTD ESC Chamber

The Plasma Etching Quartz Ring presented here is a precision ground cover ring engineered for HTD electrostatic chuck (ESC) etching chambers. Fabricated from semiconductor-grade PQ811E fused quartz, this ring shields the wafer edge and the surrounding chamber hardware from reactive plasma while maintaining dimensional stability throughout long etch campaigns. Manufactured in an ISO-controlled facility and finished with Class 100 chemical cleaning, the ring delivers the low particle and low metallic contamination levels that advanced wafer fabs demand. Every Plasma Etching Quartz Ring is produced strictly according to customer drawings, with tight tolerances held on both the inner and outer diameters so that the part seats into the etch module without rework. Whether you operate a single HTD ESC tool or a fleet of chambers, this ground quartz cover ring is built to repeat, chamber after chamber.

• Semiconductor-Grade PQ811E Fused Quartz: We machine this Plasma Etching Quartz Ring from PQ811E fused quartz supplied by Pacific Quartz, a material qualified for semiconductor front-end service. Its low metallic impurity profile protects wafer yield during aggressive etch chemistries.
• Precision Ground Geometry: Both faces and the bore are ground to hold ±0.01 mm on the key diameters, keeping plasma confinement uniform and preventing arcing at the chamber edge.
• HTD ESC Chamber Compatibility: The ring profile matches the original cover ring envelope of HTD ESC etch modules, so no fixture modification or adapter is required during replacement.
• Class 100 Chemical Cleaning: Each cover ring is acid cleaned, dried and packed inside a Class 100 clean room, so the part arrives free of particles that would otherwise seed defects in the reaction chamber.
• Thermal and Chemical Stability: Fused quartz resists the fluorine and chlorine based plasmas used in dielectric etching and withstands the thermal cycling of high throughput production lines.
• Low Particle and Metal Contamination: Tight process control keeps surface particles and trace metals at the levels demanded by 200 mm and 300 mm device lines.
• Drawing Based Custom Fabrication: Beyond the standard envelope, we fabricate custom diameters, steps and chamfers from your technical drawings, with quotations returned within one to two days.

The Plasma Etching Quartz Ring is designed for dry plasma etching and related front-end modules. It is most frequently specified for HTD ESC chambers, where it protects the wafer edge and the electrostatic chuck from ion bombardment. The same ground quartz cover ring geometry is also used in dielectric etch, conductor etch and plasma strip tools that process 200 mm and 300 mm wafers. Because fused quartz is electrically insulating and thermally stable, the ring helps stabilise the plasma sheath and reduces the risk of particle generation at the wafer perimeter. Fabs also deploy these rings as economical replacements for worn OEM cover rings, extending chamber life between wet cleans while maintaining process uniformity and repeatable etch rates.

Each Plasma Etching Quartz Ring is inspected piece by piece against the approved drawing before it leaves the clean room. Our inspectors use coordinate measuring machines, digital microscopes, surface roughness testers, height gauges and calipers, and they work to a written SOP so that every ring is measured the same way. Finished parts are acid cleaned, dried and sealed in a clean plastic bag, then packed in a blue corrugated box and a master carton for export. Standard lead time is 30 to 45 days, and monthly capacity exceeds 1,000 pieces per month, so repeat and blanket orders are welcome. We ship FOB Shanghai by default, with EXW, CFR, CIF, DDP and DAP terms available on request, and we accept T/T, L/C, D/A and D/P. Please send your drawing with each enquiry and we will quote within one to two days.